![]() ENCAPSULATION METHOD
专利摘要:
The present invention relates to a method for preparing solid capsules comprising a compound A, dispersed in a composition C4. 公开号:FR3031914A1 申请号:FR1550617 申请日:2015-01-27 公开日:2016-07-29 发明作者:Jerome Bibette;Jamie Dean Walters 申请人:Jerome Bibette;Jamie Dean Walters; IPC主号:
专利说明:
[0001] The present invention relates to an encapsulation process, the capsules obtained by this method, a composition comprising them, and a method using such capsules. In the context of a chemical reaction on an industrial scale, in order to provide the reagents necessary for said reaction, it is often necessary to isolate a reagent from another reagent (or a reaction mixture) until such time as possible. it is desired to use this reagent. It is indeed desirable that a given reagent be introduced at the appropriate time in a medium in order to optimize the chemical reaction that must take place. In general, this problem is solved by providing each reagent in separate packages, and mixing the various reagents together at the time of reaction. This solution nevertheless has drawbacks. Thus, each reagent requires to be stored in a separate package, which increases the costs associated with these packaging, the overall weight of reagents to supply, and therefore the distribution costs. In addition, for the purpose of trying to minimize these costs despite these various conditions, large packages are used to store these reagents, which requires the user to accurately measure the amount of each reagent required during implementation. of the reaction he wishes to achieve. This constraint is liable to generate measurement errors and thus variations in the properties of the final product of the reaction. Another solution considered was to encapsulate the reagents in order to isolate them completely and release them on command at the moment chosen to implement the reaction. However, the methods proposed for encapsulating the reagents in bulk have proved unsatisfactory to completely confine, without any contamination or leakage, said reagents in the bulk. More recently, the chemical industry has considered using microfluidics to more effectively encapsulate reagents. Microfluidics could in principle be used for this application, but the technical constraints of this technology are currently not compatible with the imposed production rates and the flexibility required by industrial production demands. The encapsulation methods proposed so far do not meet the constraints imposed by the production of chemicals on an industrial scale. [0002] There is therefore a need for a more efficient means of reagent delivery for the purpose of achieving a chemical reaction, particularly on an industrial scale. An object of the present invention is to provide a method of encapsulation of a compound, typically a reagent, for completely isolating said compound from the external medium, which does not have the disadvantages of the existing means. It is another object of the present invention to provide such a method which further enables the release of the encapsulated compound to be triggered on command, for example to react with another compound present in the external medium. [0003] In particular, the object of the present invention is to provide a process for conditioning two compounds, typically two reagents, within the same formulation, making it possible to isolate a first compound from a second compound, without these They do not react with each other. [0004] The present invention is based on an encapsulation method, which makes it possible to respond to the above technical problems and which does not have the disadvantages of existing encapsulation methods. According to a first subject, the present invention relates to a process for the preparation of solid capsules, comprising the following steps: a) stirring addition of a composition C1 comprising at least one compound A, in a liquid composition C2 comprising a thermoplastic material expandable, C1 and C2 not being miscible within each other, C2 being at a temperature T2, whereby an emulsion comprising drops of composition C1 dispersed in composition C2, b) stirring addition is obtained; of the emulsion obtained in step a) in a liquid composition C3 capable of being polymerized, C3 and C2 not being miscible with each other, C3 being at a temperature T3, preferably equal to T2 by which an emulsion comprising drops dispersed in the composition C3 is obtained; c) addition with stirring of the emulsion obtained in step b) in a liquid composition C4, C4 and C3 being immiscible; one in the other, 3 C4 being at a temperature T4 less than or equal to T2 and less than or equal to T3, whereby an emulsion is obtained comprising drops dispersed in the composition C4, and d) polymerization of the drops obtained in step c) by which solid capsules dispersed in the composition C4 are obtained. The release of the compound A contained in the solid capsules obtained according to the process of the invention is initiated by a rise in temperature, which results in an expansion of the heat-expandable material of the composition C2, which causes a rupture of the envelope. rigid polymerized capsules (which it can not expand due to polymerization). This aspect of the invention will be detailed later. The steps of the process of the invention will now be described. [0005] Process Step a) During step a), a composition C1, which is typically liquid, is added, preferably dropwise, to a liquid composition C2 heated to the temperature T2. At the temperature T2, the compositions C1 and C2 are not miscible with each other, that is to say at this temperature the composition C1 is not soluble in the composition C2, and vice versa. More precisely, by "C1 and C2 are not miscible with each other", it is meant that, at a given temperature, the quantity (by mass) of 25 Cl capable of being solubilized in C2 is less than or equal to at 5%, preferably less than or equal to 1%, preferably less than or equal to 0.5% relative to the total weight of C2, and that the amount (by mass) of C2 capable of being solubilized in Cl is less than or equal to 5%, preferably less than or equal to 1%, preferably less than or equal to 0.5%, relative to the total weight of C1. [0006] Thus, when it comes into contact with the composition C2 with stirring, the composition C1 is dispersed in the form of drops, called simple drops. Composition C2 is stirred to form a liquid-liquid emulsion comprising drops of composition C1 dispersed in composition C2. This emulsion is also called "simple emulsion" or C1-in-02 emulsion. [0007] To carry out step a), any type of stirrer usually used to form emulsions, such as, for example, an ultrasonic homogenizer, a membrane homogenizer, a high pressure homogenizer, a colloid mill, can be used. , a high shear disperser or a high speed homogenizer. [0008] The composition C1 comprises at least one compound A. This composition C1 serves as a carrier for compound A in the process of the invention, in the drops formed during the process of the invention and the solid capsules obtained. According to a first variant of the process of the invention, the composition C1 is monophasic, that is to say that it is pure compound A or a solution comprising compound A in solubilized form. According to this variant, the composition C1 typically consists of a solution of the compound A in an organic solvent, or a mixture of organic solvents, the compound A being present in a mass content of between 1% and 99%, relative to the total mass. of the composition C1. Compound A may be present in a mass content of from 5% to 95%, from 10% to 90%, from 20% to 80%, from 30% to 70%, or from 40% to 60%, by weight. to the total mass of the composition C1. According to one embodiment, the composition C1 consists of the compound A. According to this variant, in the drops formed at the end of step a), the compound A present in the composition C1 is directly in contact with the envelope of composition C2. Nevertheless, because of the immiscibility between the composition C1 and the composition C2, the compound A remains confined in the heart of the drops. FIG. 1 schematically represents a process according to this variant of the invention and represents in particular schematically drops 1 obtained at the end of step a) and the solid capsules 30 obtained in fine according to this variant of the method . According to a second variant of the process of the invention, the composition C1 is biphasic and comprises, besides the compound A, a liquid composition C'3 capable of being polymerized, said composition C'3 corresponding preferably to the composition C3 used during of the subsequent step b). According to this variant, the composition Cl is an emulsion formed by drops of a solution comprising the compound A in solubilized form, said drops being dispersed in the composition C'3. The solution comprising compound A typically consists of a solution of compound A in an organic solvent or a mixture of organic solvents. This solution typically comprises from 1% to 99%, even 5% to 95%, 10% to 90%, 20% to 80%, 30% to 70%, or 40% to 60%. compound A with respect to the total mass of said solution. The composition C '3 is typically present in the composition C1 in a mass content of from 1% to 50%, or even from 10% to 40%, or from 20% to 30%, with respect to the total weight of said composition. C1. Such a composition C1 is typically obtained by dispersing, with stirring, a solution comprising the compound A in solubilized form in a liquid composition C'3, said solution and said liquid composition C'3 not being miscible with one in the other. [0009] According to this variant, the drops formed at the end of step a) typically comprise a core comprising compound A and a liquid envelope of composition C'3 disposed around said core, said drops being dispersed in composition C2. By "envelope disposed around said core" is meant that the envelope 15 surrounds, preferably totally, said core so that it can not escape the enclosure formed by said envelope. Preferably, the envelope surrounding said core is disposed in contact with said core. It is also said that the heart is "encapsulated" in the envelope. The solid capsules obtained at the end of step d) of the process according to this variant thus comprise two rigid polymerized shells: one internal in contact with the core containing the compound A, and the other external at the periphery. FIG. 2 schematically represents a process according to this variant of the invention and represents in particular schematically drops obtained at the end of step a) and solid capsules obtained in fine according to this variant of the process. . According to a third variant of the method of the invention, after step b) and before step c), steps a) and b) are repeated at least once. The sequence of the steps of the process according to this variant is thus a) -b) -a) -b) -c- (c) -d). The solid capsules obtained at the end of step d) thus comprise at least two rigid envelopes polymerized. The layers of protection are thus multiplied between the core and the external environment, which eliminates any risk of unwanted leakage of compound A. [0010] Figure 5 shows schematically solid capsules obtained in fine according to this variant of the process. [0011] Compound A is, for example, a dye, a perfume (as listed by IFRA), a pigment such as titanium dioxide, a care active such as, for example, proteins, vitamins, plant extracts, amino acids , lipids, or a bioactive compound such as an enzyme. Compound A may also be a reagent capable of reacting with another reagent contained in the composition comprising the capsules of the invention. This aspect of the invention will be discussed in more detail below. [0012] Composition C2 comprises a heat-expandable material. In the context of the present invention, the term "thermally expandable material" means a material, solid or liquid at ambient temperature (i.e. between 20 ° C. and 25 ° C.), the volume of which varies reversibly as a function of its temperature. In other words, a thermally expandable material expands as its temperature increases and contracts as its temperature decreases. This property is quantified by its volume expansion coefficient, expressed in K-1, and determined at a given temperature. Preferably, the heat-expandable material of the invention has a volume expansion coefficient greater than or equal to 1.10-4 K-1, at a temperature of 20 ° C. Before the addition of the composition C1, the composition C2 is brought to a temperature T2 such that the heat-expandable material is in liquid form (or melted). The temperature T2 may be adapted depending on the physicochemical characteristics of the heat-expandable material, but preferably remains greater than or equal to the melting point of said heat-expandable material. According to one embodiment, the composition C2 is in solid form (or frozen) at room temperature and in liquid form (or melted) at the temperature T2. This is typically the case when the heat-expandable material has a melting point above room temperature, such as a solid wax at room temperature. According to another embodiment, the composition C2 is in liquid form at room temperature and in liquid form (or melted) at the temperature T2. This is typically the case when the heat-expandable material has a melting point below room temperature, such as a liquid fluorocarbon at room temperature. [0013] These particular embodiments will be detailed hereinafter. At the temperature T2, the composition C2 is liquid and typically has a viscosity greater than or equal to 1 cP, preferably from 1 cP to 10,000 cP, preferably from 10 cP to 1000 cP, for example of the order 100 cP. The viscosity is for example measured using a HAAKETM RheoStress 600 rheometer, at the temperature T2. Preferably, at the temperature T2, the composition C2 is more viscous than the composition C1. This allows an improved formation of the C1-in-C2 emulsion without the phenomenon of coalescence of droplets of composition C1. The temperature T2 is typically greater than or equal to 10 ° C, preferably greater than or equal to 20 ° C, advantageously between 30 ° C and 200 ° C, preferably between 30 ° C and 100 ° C. The temperature T2 is for example from 20 ° C to 40 ° C. Preferably, T2 is such that it does not alter the constituents of the composition C2 or the composition C1, and / or that it does not evaporate the solvents possibly present in the composition C1. [0014] The heat-expandable material is typically present at a level of from 1% to 100%, preferably from 10% to 90%, preferably from 30% to 70%, by weight relative to the total weight of the composition C2. According to one embodiment, the heat-expandable material is selected from the group consisting of waxes, fluorocarbons, and mixtures thereof. According to a preferred embodiment, the heat-expandable material is a wax or a mixture of waxes. The wax (es) considered in the context of the present invention is (are) in general a lipophilic compound, solid at ambient temperature (between 20 ° C. and 25 ° C.), reversible solid / liquid state change, having a melting point greater than or equal to 30 ° C up to 200 ° C and especially up to 120 ° C. Waxes are thermally expandable materials, which expand particularly (but not only) during their liquid solid state changes. [0015] When the heat-expandable material is selected from the group consisting of waxes, T2 is preferably greater than or equal to the melting point of said wax, so that the composition C2 is liquid at the temperature T2. In this case, T4 is preferably less than or equal to the melting point of said wax, so that in the drops obtained at the end of step c), and in the solid capsules obtained at the end of step d), the composition C2 is in solid form. [0016] In this case, the release of the encapsulated compound A is typically initiated by subjecting the capsules to a temperature greater than or equal to the melting point of the wax used as the heat-expandable material. The change of liquid solid state of the wax causes a dilation of the composition C2 and thus a rupture of the polymerized rigid envelope of the capsules. [0017] The waxes that are suitable for the invention may have a melting point greater than or equal to 35 ° C., in particular greater than or equal to 40 ° C., preferably greater than or equal to 45 ° C., preferably greater than or equal to 50 ° C. preferably greater than or equal to 60 ° C, even greater than or equal to 70 ° C, or alternatively to P ° C, 90 ° C, 100 ° C, 110 ° C, or 150 ° C. [0018] Within the meaning of the invention, the melting point (or melting temperature) corresponds to the temperature of the most endothermic peak observed in thermal analysis (DSC) as described in the ISO 11357-3 standard; 1999. The melting point of the wax can be measured using a differential scanning calorimeter (DSC), for example the calorimeter sold under the name "DSC 02000" by the company TA Instruments. [0019] The wax (es) may be hydrocarbon (s), fluorinated (s) and / or silicone (s) and may be of vegetable, mineral, animal and / or synthetic origin. It is also possible to use a mixture of waxes, of the same or different type. It is preferable to use as wax (s), hydrocarbon waxes such as beeswax, lanolin wax, and Chinese insect waxes, rice wax, carnauba wax, wax. of Candellila, Ouricurry wax, Alfa wax, Esparto wax, cork fiber wax, sugar cane wax, orange wax and lemon wax, shellac wax, wax from Japan and sumac wax, lignite wax, microcrystalline waxes, paraffin waxes and ozokerite, polyethylene waxes, Fisher-Tropsch synthesis waxes and waxy copolymers and their esters . Mention may also be made of polyvinyl ether waxes, waxes based on cetyl palmitate, glycerol ester and fatty acid waxes, ethylene copolymer waxes, oxidized polyethylene waxes, ethylene homopolymer waxes, waxes polyethylene waxes, polyether waxes, ethylene / vinyl acetate copolymer waxes and polypropylene waxes. [0020] The waxes obtained by catalytic hydrogenation of animal or vegetable oils having linear or branched C5-032 fatty chains may also be mentioned. Among these, there may be mentioned isomerized jojoba oil, hydrogenated sunflower oil, hydrogenated castor oil, hydrogenated coconut oil and hydrogenated lanolin oil. Mention may also be made of silicone waxes such as alkyl or alkoxy dimethicone containing from 16 to 45 carbon atoms and fluorinated waxes. It is also possible to use the wax obtained by hydrogenation of olive oil esterified with fatty alcohols or else the waxes obtained by hydrogenation of castor oil esterified with fatty alcohols. These waxes can be used separately or in combination to adjust the properties, such as the viscosity and melting point of the heat-expandable material. As useful waxes, mention may be made of hydrocarbons (n-alkanes, branched alkanes, olefins, cyclic alkanes, isoprenoids), ketones (monocetones, R-diketones), secondary alcohols, alkanediols (1,2-alkane) diols, alkane-2,3-diols, alkane-α,--diols), acids (alkenoic acid and alkanoic acid), ester waxes (primary alcohol esters and secondary alcohol esters), diester waxes (Alkanediol diesters, hydroxyl acid diesters), triester waxes (triacylglycerols, triesters of alkane-1,2-diol, w-hydroxy acid and fatty acid, esters of hydroxymalonic acid, 20 fatty acid and alcohol, triesters of hydroxyl acids, fatty acid and fatty alcohol, triesters of fatty acid, hydroxyl acid and diol) and polyester waxes (polyesters of fatty acids). For example, n-octacosan, n-heptacosane, n-hexacosane, n-pentacosan, n-tetracosane, n-tricosane, n-docosan, n-heneicosane, neicosane, n Nonadecane, myristyl alcohol, pentadecyl alcohol, cetyl alcohol, palmitoleyl alcohol, heptadecyl alcohol, stearyl alcohol, nonadecyl alcohol, arachidyl alcohol, henicosyl alcohol, behenyl alcohol, erucyl alcohol, lignocyclic alcohol, ceryl alcohol, 1-heptacosanol, montanyl alcohol, cluytyl alcohol, 1-octacosanol, 1-nonacosanol, myricyl alcohol, melissyl alcohol, 1-triacontanol and 1-dotriacontanol. [0021] The fatty acids which can be used as waxes in the context of the process of the invention are, for example, cerotic acid, palmitic acid, stearic acid, behenic acid, lignoceric acid and arachidic acid. , myristic acid, lauric acid, tridecyclic acid, pentadecyclic acid, margaric acid, nonadecyclic acid, henicosylic acid, tricosylic acid, pentacosylic acid, heptacosylic acid , montanic acid, and nonacosylic acid. [0022] The fatty acid esters which can be used as waxes in the context of the process of the invention are, for example, cetyl palmitate, cetyl octanoate, cetyl laurate, cetyl lactate and isononanoate. cetyl stearate, stearyl stearate, myristyl stearate, cetyl myristate, isocetyl stearate, glyceryl trimyristate, glyceryl tripalmitate, glyceryl monostearate, and glyceryl palmitate, and cetyl. The use of a wax has the advantage of being able to adapt the heat-expandable material depending on the desired use of the capsules obtained by the process of the invention. It is indeed possible to select the wax used according to its melting point and the desired release temperature. If it is desired to encapsulate compound A below 35 ° C. and to release it when the temperature reaches this threshold temperature, a paraffin wax may be used (melting point of the order of 37 ° C.). [0023] For a release at 40 ° C., the SUFPOCIRE® DM from GATTEFOSSE (melting point of 42 ° C.) can be used. For a release at 45 ° C., it is possible to use a polyvinyl ether (melting point of about 47 ° C.). For release at 50 ° C, cetyl palmitate based on cetyl palmitate (mp 54 ° C) can be used. For a release at 60 ° C, beeswax (melting point of order 62 ° C) can be used. For liberation at 65 ° C, Candelilla can be used (melting point 68 ° C). [0024] For release at 75 ° C, the rice bran (melting point 77 ° C) can be used. For a liberation at 80 ° C., it is possible to use the carnauba cite (melting point of the order 82 ° C.) or the lignite wax (melting point of the order 82 ° C.) or the shellac wax (point 80-100 ° C melting point). [0025] For release at 90 ° C., an ethylene copolymer (mp 90 ° C) or oxidized polyethylene wax (melting point 94 ° C) can be used. For a release at 100 ° C., it is possible to use an ethylene homopolymer wax (melting point of about 100 ° C.). [0026] For release at 110 ° C., a polyethylene wax (melting point of about 110 ° C.) or an ethylene-ethyl acetate copolymer wax (melting point of about 110 ° C.) can be used. For liberation at 160 ° C., a polypropylene wax (melting point of about 160 ° C.) can be used. The waxes mentioned above can be modified to adjust their melting point. For example, the paraffin wax may be C-18 (28 ° C), C-20 (37 ° C) or C-34 (76 ° C). [0027] According to a particular embodiment, the heat-expandable material comprises a wax selected from the group consisting of mono-, di- and triesters of glycerol and fatty acids having a linear or branched hydrocarbon chain comprising from 8 to 24 carbon atoms. carbon, and mixtures thereof, preferably in the group consisting of glycerol trimyristate, glycerol tripalmitate, glycerol monostearate, glycerol cetylpalmitate and mixtures thereof. According to a particular embodiment, the heat-expandable material further comprises phosphatides derived from lecithin, such as, for example, phosphatidylcholine and phosphatidylethanilamine. [0028] As a heat-expandable material that can be used in the context of the present invention, there may be mentioned the wax SUPPOCIRE® DM Pastilles from the company GATTEFOSSE. According to another preferred embodiment, the heat-expandable material is a fluorocarbon. A fluorocarbon considered in the context of the present invention is generally an organic compound in which at least a portion of the hydrogen atoms are replaced by fluorine atoms. A fluorocarbon considered is, for example, an organic compound in which all the hydrogen atoms are replaced by fluorine atoms, which is then called perfluorocarbon. The fluorocarbons can be solid or liquid at room temperature (between 20 ° C and 25 ° C), or even have a boiling point of less than or equal to 200 ° C. Fluorocarbons are heat-expandable materials, which expand particularly in their changes of liquid solid state and / or liquid gas. [0029] Alternatively, the heat-expandable material is a fluorocarbon solid at room temperature (between 20 ° C and 25 ° C). According to this variant, T2 is preferably greater than or equal to the melting point of the fluorocarbon. [0030] According to this variant, the release of encapsulated compound A is typically initiated by subjecting the capsules to a temperature greater than or equal to the melting point of the fluorocarbon used as a heat-expandable material. The liquid solid state change of the fluorocarbon causes expansion of the composition C2 and thus a rupture of the polymerized rigid envelope. [0031] According to another variant, the heat-expandable material is a liquid fluorocarbon at ambient temperature (between 20 ° C. and 25 ° C.) According to this variant, T2 is typically equal to ambient temperature. According to this variant, T4 is also typically equal to the ambient temperature. According to this variant, the release of the encapsulated compound A is typically initiated by subjecting the capsules to a temperature above the boiling point of the fluorocarbon used as a heat-expandable material. The change in liquid gas state of the fluorocarbon causes expansion of the composition C2 and thus rupture of the polymerized rigid shell. The fluorocarbons that are suitable for the invention may have a melting point greater than or equal to 35 ° C., in particular greater than or equal to 40 ° C., preferably greater than or equal to 45 ° C., preferably greater than or equal to 50 ° C., advantageously greater than or equal to 60 ° C, even greater than or equal to 70 ° C, still at 80 ° C, at 90 ° C, or at 100 ° C. The fluorocarbons that are suitable for the invention may have a boiling point greater than or equal to 80 ° C., in particular greater than or equal to 90 ° C., preferably greater than or equal to 100 ° C., preferably greater than or equal to 150 ° C. advantageously greater than or equal to 180 ° C. [0032] Examples that may be mentioned include C 6 -C 20 fluorinated aromatic compounds, C 6 -C 20 fluorinated linear or cyclic hydrocarbons, C 6 -C 20 fluorinated unsaturated linear hydrocarbons, C 3 -C 20 fluorinated esters (formic acid esters), acetic acid or butyric acid), fluorinated C3-C20 ethers, fluorinated C3-C20 ketones, and fluorinated C3-C20 carbonates (ethylene carbonate, propylene carbonate, butylene carbonate, etc.) . [0033] By "fluorinated" is meant that the organic compound carries at least one fluorine atom, typically from 1 to 20 fluorine atoms, preferably from 2 to 10 fluorine atoms, for example from 3 to 10. By way of example, mention may be made ("mp" being the melting point and "bp" being the boiling point of the material): fluorinated benzophenones, such as decafluorobenzophenone (bp: 206 ° C., mp: 92 -94 ° C) and 4,4'-difluorobenzophenone (Ip: 170 ° C (10 torr), mp 106-109 ° C), fluorinated benzenes, such as hexafluorobenzene (bp: 80 ° C), 1.3 Bis (trifluoromethyl) benzene (bp: 116 ° C, mp: 35 ° C), allylpentafluorobenzene (bp: 148-149 ° C, mp: 64 ° C), 1,2,3,4-tetrafluorobenzene (bp: 95 ° C, mp: 42 ° C), 1,2,3,5-tetrafluorobenzene (bp: 83 ° C, mp: 4g C), 1,2,4,5-tetrafluorobenzene (bp: 90 ° C, mp : 4 ° C), 1,2,3-trifluorobenzene (bp: 94-95 ° C), 1,2,4-trifluorobenzene (bp 88-91 ° C, mp: 12C), 1,3,5-trifluorobenzene (bp: 94-95 ° C), Trifluorobenzene (bp: 75-76 ° C, mp: 5.5 ° C), 1,2-diol thorobenzene (bp: 92 ° C, mp: 34 ° C), 1,3-difluorobenzene (bp: 83 ° C, mp: 59 ° C) 1,4-difluorobenzene (bp: 88-89 ° C, mp: 13) ° C), fluorobenzene (bp: 85 ° C, go: 42 ° C), (trifluoromethoxy) benzene (bp: 102 ° C), 1-ethynyl-4-fluorobenzene (bp: 55 ° C (40 mmHg), mp 27-28 ° C), 1,4-bis (difluoromethyl) benzene (bp: 70 ° C (2.7 KPa)), 1-acetoxy-4-fluorobenzene (bp: 197 ° C), and 2, 4,6-trimethylfluorobenzene (bp: 163-165 ° C), fluorinated toluenes, such as octafluorotoluene (bp: 104 ° C, mp: 65.6 ° C), α, α, α-trifluorotoluene (bp: 102 °) C, mp: 29 ° C), 2,6-difluorotoluene (bp: 112 ° C), o-fluorotoluene (bp: 114 ° C, mp: 62 ° C), mitiorotoluene (bp: 115 ° C, 25 mp: 87 ° C), p-fluorotoluene (bp: 116 ° C, mp: 53 ° C), t 2,4-difluorotoluene (bp: 114-116 ° C), fluorinated xylenes, such as 3-fluoro-o- xylene (bp: 148-152 ° C), fluorinated naphthalenes, such as octafluoronaphthalene (bp: 209 ° C, mp: 87-88 ° C) and 1-fluoronaphthalene (bp: 215-217 ° C, mp: 13C) , Fluorinated styrenes such as 2-fluorostyrene (bp: 29-30 ° C) and 4-fluorostyrene (bp: 67 ° C (50 mmHg), mp: 36 ° C), the fluorinated decines such as perfluorodecalin (mixture of cis and trans, bp: 142 ° C, mp: 10 ° C), linear or cyclic hydrocarbons, such as 1-fluorohexane (bp: 93 ° C), perfluoro-1,3-dimethylcyclohexane (bp: 101-102 ° C, mp: 55 °) C), fluoropentane (bp: 62-63 ° C), 1-fluorononane (bp 186-169 ° C), and perfluoro-2-methyl-2-pentene (bp 53-61 ° C) ( perfluorobutypethylene (bp: 58 ° C), and fluorinated esters such as ethyl fluoroacetate (bp: 117 ° C), ethyl 4,4,4-trifluoroacetoacetate (bp: 131 ° C, mp: 39 ° C), and meltlyl 2 Preferably, the fluorocarbon is selected from the group consisting of 1,2-difluorobenzene, hexafluorobenzene, perfluoro-1,3-dimethylcyclohexane and o-fluorotoluene. [0034] It is of interest to use a fluorocarbon as a heat-expandable material in cases where a wax could not be used, for example when it is desired to encapsulate a lipophilic compound that would be miscible with the waxes. In addition, the use of a fluorocarbon having a relatively low boiling point (typically less than or equal to 120 ° C.) makes it possible to remove the heat-expandable material easily by evaporation, typically during the process of releasing the compound. Encapsulated (this process will be detailed below). According to one embodiment, the composition C2 comprises, in addition to the heat-expandable material, at least one polyolefin, preferably a poly-alpha-olefin. Poly-alpha-olefins are a family of polyolefins (polyalkenes) derived from olefins having a double bond in the alpha position. The presence of a polyolefin in the composition C2 makes it possible to advantageously adjust its viscosity to the desired viscosity, and / or to adjust the melting point of the composition C2. When the heat-expandable material tends to crystallize as it cools, the use of a polyolefin advantageously avoids the formation of crystals and provides spherical capsules. As polyolefin usable in the context of the present invention, there may be mentioned poly-alpha-olefin SYNTON® PAO 100 CHEMTURA company. The polyolefin is typically present in a content of from 5% to 60% by weight relative to the total weight of the composition C2. According to one embodiment, the composition C2 comprises, in addition to the heat-expandable material, a liquid hydrocarbon, aliphatic or aromatic, natural or synthetic, such as for example a mineral oil. [0035] The presence of a liquid hydrocarbon advantageously dilutes the heat-expandable material, to adapt the viscosity of the composition C2. [0036] Step b) During step b), the emulsion obtained at the end of step a) is added, preferably dropwise, to a liquid composition C3 heated to the temperature T3. . [0037] At temperature T3, compositions C2 and C3 are not miscible with each other. Thus, when the C1-in-C2 emulsion comes into contact with the composition C3 with stirring, so-called double drops are formed. In Figures 1 and 2, the drops 10 and 15 are schematic representations of double drops that can be obtained. [0038] Generally, a double drop formed corresponds to a simple drop previously formed, surrounded by a composition envelope C2 disposed around said single drop, said double drops being dispersed in the composition C3. The emulsion obtained is also called "triple emulsion" or emulsion 01-in-C2-inC3-in-04. [0039] According to one embodiment, a double drop formed corresponds to several simple drops previously formed, surrounded by a single envelope of composition C2 arranged around said single drop, said double drops being dispersed in the composition C3. Thus, the heart of the double drops formed is composed of one or more drops of composition C1. The emulsion obtained is also called "double emulsion" or emulsion 01-inC2-in-03. Preferably, at the temperature T3, the compositions C1 and C3 are not miscible with each other, especially in the case of the first variant described above where the composition C1 is monophasic. This has the advantage of preventing the double drops formed from becoming destabilized in case of rupture or destabilization of the composition envelope C2, which would lead to a leakage of the compound A and a contamination of the composition C3. To carry out step b), any type of stirrer usually used to form emulsions, such as for example an ultrasonic homogenizer, a membrane homogenizer, a high pressure homogenizer, a colloid mill, high shear disperser or a high speed homogenizer. [0040] Before the addition of the emulsion O1-in-C2, the composition C3 is brought to a temperature T3 such that the composition C3 is in liquid form. [0041] At the temperature T3, the composition C3 typically has a viscosity greater than or equal to 800 cP, preferably from 800 cP to 150,000 cP, preferably 10,000 cP to 60,000 cP. Preferably, at the temperature T3, the composition C3 is more viscous than the C1-in-O2 emulsion. This allows improved formation of Cl-in-C2-emulsion in-C3, without coalescence phenomenon of C1-in-O2 emulsion droplets. The temperature T3 is typically greater than or equal to 10 ° C, preferably greater than or equal to 20 ° C, advantageously between 30 ° C and 200 ° C, preferably between 30 ° C and 100 ° C. [0042] The temperature T3 is for example equal to the temperature T2. The temperature T3 is for example between 20 ° C and 40 ° C. The temperature T3 can be adapted according to the case, but is such that the composition C3 remains liquid at this temperature. Preferably, the temperature T3 is such that it does not alter the constituents of the compositions C1 or C2, and / or that the solvents possibly present in the composition C1 are not evaporated. The composition C3 is capable of being polymerized. In the context of the present invention, the term "composition capable of being polymerized" means a composition which polymerises under certain conditions to form a solid and rigid material. According to one embodiment, the composition C3 comprises at least one unsaturated monomer or unsaturated pre-polymer, a crosslinking agent and a photoinitiator. [0043] According to this embodiment, the composition C3 typically comprises from 50% to 95% by weight of unsaturated monomer or an unsaturated prepolymer, based on the total weight of said composition C3. According to this embodiment, the composition C3 typically comprises from 1% to 20% by weight of crosslinking agent, relative to the total weight of said composition C3. [0044] According to this embodiment, the composition C3 typically comprises from 0.1% to 5% by weight of photoinitiator, relative to the total weight of said composition C3. By "unsaturated monomer" is meant a monomer bearing at least one unsaturated, typically ethylenic, polymerizable to provide a solid and rigid material. [0045] As unsaturated monomer, there may be mentioned monomers bearing at least one (meth) acrylate function. These monomers may also carry one or more functions selected from the group consisting of primary, secondary and tertiary alkylamine functions, quaternary amine functions, sulphate, sulphonate, phosphate, phosphonate, carboxylate, hydroxyl, halogen functions, and mixtures thereof. The term "unsaturated pre-polymer" means a polymer or oligomer carrying at least one unsaturated, typically ethylenic, polymerizable to provide a solid and rigid material. [0046] As unsaturated pre-polymer, there may be mentioned prepolymers bearing (meth) acrylate functions, such as polyurethanes, polyesters, polyureas, polyethers and polydimethylsiloxanes, carrying (meth) acrylate functions. By "crosslinking agent" is meant a compound carrying at least two reactive functions capable of crosslinking an unsaturated monomer or an unsaturated prepolymer during its polymerization. Examples of crosslinking agents that may be mentioned are diacrylates, such as 1,6-hexanediol diacrylate. [0047] By "photoinitiator" is meant a compound capable of fragmenting under the effect of light radiation and initiating the polymerization of an unsaturated monomer or an unsaturated prepolymer. The photoinitiators usable according to the present invention are known in the art and are described, for example in "Photoinitiators in the crosslinking of coatings", G. Li Bassi, Double Liaison - Chemistry of Paints, No. 361, November 1985, p. .34-41; "Industrial applications of photoinduced polymerization", Henri Strub, L'Actualité Chimique, February 2000, p.5-13; and "Photopolymers: Theoretical Considerations and Catch Response", Marc, J.M. Abadie, Double Liaison - Paint Chemistry, No. 435-436, 1992, p.28-34. [0048] These photoinitiators include: α-hydroxyketones, sold for example under the names DAROCUR® 1173 and 4265, IRGACURE® 184, 2959, and 500 by the company BASF, and ADDITOL® CPK by the company CYTEC, the α-aminoketones, marketed for example under the names IRGACURE® 907 and 369 by BASF, 3031914 19 aromatic ketones marketed for example under the name ESACURE® TZT by LAMBERTI. Mention may also be made of thioxanthones marketed for example under the name ESACURE® ITX by LAMBERTI, and quinones. These aromatic ketones most often require the presence of a hydrogen donor compound such as tertiary amines and especially alkanolamines. It is possible to mention the tertiary amine ESACURE® EDB sold by the company LAMBERTI. the α-dicarbonyl derivatives, the most common representative of which is benzyldimethylketal, marketed under the name IRGACURE® 651 by BASF. Other commercial products are marketed by LAMBERTI under the name ESACURE® KB1, and acylphosphine oxides, such as, for example, bisacylphosphine oxides (BAPO) sold for example under the names IRGACURE® 819, 1700, and 1800. , DAROCUR® 4265, LUCIRIN® TPO, and LUCIRIN® TPO-L by BASF. Preferably, the composition C3 comprises: an acrylate-functional polyurethane prepolymer, an alkylenediol diacrylate, and an α-hydroxyketone type photoinitiator. According to a preferred embodiment, the composition C3 is intended to form, once polymerized during step d), a polyacrylate envelope. [0049] According to one embodiment, the composition C3 comprises oligomers of polyester or polyurethane or polyurea or polyether or polydimethylsiloxane type, bearing terminal or pendant acrylate functional groups, as well as a photoinitiator. According to one embodiment, the composition C3 comprises unsaturated polyester oligomers, styrene, and a photoinitiator. [0050] According to one embodiment, the composition C3 comprises mercaptoesters and thiolenes, and a photoinitiator. According to one embodiment, the composition C3 comprises multifunctional epoxides or cyclic ethers or cyclic siloxanes or oxetanes, or vinyl ethers, and a cationic photoinitiator. [0051] Step c) During step c), the emulsion obtained at the end of step b) is added, preferably dropwise, to a liquid composition C4 brought to the temperature of 30.degree. T4. [0052] At temperature T4, compositions C3 and C4 are not miscible with each other. Thus, when the C1-in-C2-in-C3 emulsion comes into contact with the composition C4 with stirring, so-called triple drops are formed. In Figures 1 and 2, the drops 20 and 25 are schematic representations of triple drops obtainable. [0053] According to one embodiment, a triple drop formed corresponds to a double drop previously formed, surrounded by an external envelope of composition C3 disposed around said double drop, said triple drop being dispersed in the composition C4. The emulsion obtained is also called "triple emulsion" or C1-in-C2-emulsion in-C3-in-C4. [0054] According to this mode, when the double drop comprises a single drop of Cl composition as a core, the triple drop obtained has a core composed of a drop of composition C1, an inner envelope of composition C2 arranged around said heart, and a external envelope of composition C3 disposed around said inner envelope, said drops being dispersed in the composition C4. [0055] According to this embodiment, when the double drop comprises several drops of composition C1 as a core, the triple drop obtained has a core composed of several drops of composition 01, surrounded by a single internal envelope of composition C2 arranged around said core. , and an outer envelope of composition C3 disposed around said inner envelope, said drops being dispersed in the composition C4. According to another embodiment, a triple drop formed corresponds to several double drops previously formed, surrounded by a single external envelope of composition C3 disposed around said double drops, said triple drop being dispersed in the composition C4. [0056] By "outer casing disposed around said inner casing" is meant that the outer casing surrounds (or encircles), preferably totally, said inner casing so that it can not escape from the enclosure formed by said outer envelope. Preferably, the outer casing surrounding said inner casing is disposed in contact therewith. It is also said that the inner envelope is "encapsulated" in the outer envelope. [0057] Preferably, at temperature T4, compositions C4 and C2 are not miscible with each other. This has the advantage of preventing the triple drops formed from becoming destabilized in the event of rupture or destabilization of the composition envelope C3, which would lead to a leakage of the compound A and a contamination of the composition C4. At the temperature T4, the compositions C4 and Cl can be miscible with each other or not. To carry out step c), any type of stirrer usually used to form emulsions, such as for example an ultrasonic homogenizer, a membrane homogenizer, a high pressure homogenizer, a colloid mill, high shear disperser or a high speed homogenizer. Before the addition of the C1-in-C2-in-C3 emulsion, the composition C4 is brought to a temperature T4 such that the composition C4 is in liquid form, said temperature T4 being less than or equal to the temperature T2 and less than or equal to the temperature T3. According to one embodiment, the temperature T4 is less than at least 10 ° C, or even at least 15 ° C, at temperatures T2 and T3. Typically, the temperature T4 is less than or equal to 30 ° C, preferably from 0 ° C to 30 ° C, preferably 15 ° C to 30 ° C. The temperature T4 is for example between 20 ° C and 25 ° C. According to another embodiment, the temperature T4 is equal to T2 and / or T3. In this case, T4 is typically equal to room temperature (between 20 ° C and 25 ° C). When T4 is below the temperature of the C1-in-C2-in-C3 emulsion, when said emulsion contacts said composition C4, the temperature of the heat-expandable material decreases, so that the composition envelope C2 gets contracted. The envelope of liquid composition C3 which encapsulates the envelope of composition C2 is in an uncured state and follows the change in volume of the envelope that it encapsulates. Preferably, by passing to the temperature T4, the composition C2 contracts and solidifies. This is particularly the case when the composition C2 comprises, as heat-expandable material, a material (such as a wax) having a melting point between T4 and T2. [0058] When T4 is equal to T2 and T3, the composition C2 does not contract and there is no change of state of the heat-expandable material. This is typically the case when the heat-expandable material is a fluorocarbon whose melting point is less than or equal to T4 (or so T2). Preferably, at the temperature T4, the composition C4 has a viscosity less than or equal to that of the composition C3. Preferably, at temperature T4, composition C4 has a viscosity less than or equal to that of composition C2. Preferably, at the temperature T4, the composition C4 has a viscosity greater than or equal to that of the composition C1. Preferably, at the temperature T4, the composition C4 has a viscosity less than or equal to that of the C1-in-C2-in-C3 emulsion. This makes it possible to avoid phase inversion phenomena. According to one embodiment, the composition C4 is devoid of a reactive compound. According to this embodiment, the composition C4 typically has the same composition as the solvent or solvent mixture in which the compound A is solubilized within the composition C1. According to another embodiment, the composition C4 comprises at least one compound B, different from the compound A, capable of reacting with the compound A. According to this embodiment, the composition C4 is typically a solution comprising an organic solvent or a mixture of organic solvents in which compound B is in soluble form. Compound B may be present in a content of from 0.01% to 100% by weight relative to the total weight of composition C4. The dilution of compound B in composition C4 is adapted according to the desired viscosity for this composition. Compound B can be a catalyst, a monomer, a prepolymer or a crosslinking agent. [0059] Step d) During step d), the composition C3 (and the composition C'3 when it is present) is polymerized, more precisely the composition envelope C3 (and the composition envelope C '). 3 when this is present), to stiffen the drops of the C1-5 emulsion in-C2-in-C3-in-C4 obtained at the end of step c) and to obtain solid capsules. A polymerized rigid outer shell, also called polymeric bark or matrix, is thus formed around the drops. The objects formed then resemble solid capsules having a rigid bark which stabilizes the internal structure and maintains the isolation of the compound A contained in the heart. The structure of the capsules obtained makes it possible to avoid any destabilization or leakage of the compound A over time, as long as no substantial rise in temperature is imposed. In the embodiments where the drops have several envelopes of C3 polymerizable composition is formed in step d) as many envelopes polymerized. [0060] The solid capsules obtained can remain in suspension in the bulk constituted by composition C4 until the moment chosen for the release of compound A. The solid capsules obtained have the advantage of having several (at least 2) envelopes between the containing heart. compound A and the external medium (from which compound A must be isolated), thereby avoiding any contamination of the external medium. Due to the impermeability of the envelopes, the compound A is advantageously isolated from the external medium in the heart of the capsules obtained, which makes it possible to avoid any undesired reaction. In addition, even if one of the envelopes of the capsules destabilizes (typically a composition envelope C2), the heart of the capsules will in any case be retained by the other envelope or envelopes (in particular the rigid outer envelope polymerized). Unlike existing methods, the process of the invention makes it possible to reduce the costs associated with separating the compounds in separate packages. In addition, the process of the present invention is based on bulk technology which is compatible with volume constraints of the industrial scale. One way of releasing compound A is to heat the solid capsules, which expands the composition envelope C2 comprising the heat-expandable material, thus imposing a mechanical stress on the polymerized rigid shell (s) (s). ) solid capsules. [0061] According to one embodiment, step d) is carried out by exposing the drops obtained at the end of step c) to a light radiation able to polymerize the composition C3 (and the composition C'3 possibly present). ). According to one embodiment, the solid capsules obtained at the end of step d) are devoid of water and / or surfactant. The method of the invention has the advantage of not requiring water in any of the steps described. The method of the invention thus makes it possible to encapsulate compounds that are sensitive to water. The method of the invention has the advantage of not requiring surfactant in any of the described steps. The process of the invention thus makes it possible to reduce the presence of additives which could modify the properties of the final product obtained after the release of compound A. The size of the solid capsules depends on the type, the geometry, and the speed of the product. apparatus used to emulsify, but also the viscosity of the compositions and the time between step c) and step d). Those skilled in the art will be able to adapt these parameters according to the desired average particle size. The average size of the solid capsules that can be obtained according to the process of the invention is generally from 0.1 μm to 100 μm. [0062] The size of the solid capsules is typically measured using an optical microscope or transmission electron microscope, and image processing software. Alternatively, other measurement techniques based on centrifugation or dynamic light scattering can be used. [0063] In order to carry out steps a), b) and c), a high speed homogenizer type agitator, for example an ULTRA-TURRAX T 25 from IKA, is typically used. Mass ratios between compositions C1, C2, C3 and C4 can be adapted by those skilled in the art depending on the viscosity of the compositions, the stability of the emulsions, the size of the desired capsules, and the concentration of the compound. Desired in the final mixture from step d). Typically, the mass ratio C1: C2 is from 0.01 to 5.0, preferably from 0.1 to 1.0, preferably from 0.1 to 0.5. The weight ratio C1: 02 is for example equal to 0.25. [0064] Typically, the weight ratio C2: C3 is from 0.1 to 20.0, preferably from 1.0 to 10.0, preferably from 1.0 to 5.0. The mass ratio C2: C3 is for example equal to 2.0. Typically, the mass ratio C3: C4 is from 0.1 to 20.0, preferably from 1.0 to 10.0, preferably from 1.0 to 5.0. The mass ratio C2: C3 is for example equal to 2.0. Typically, the mass ratio (C1 + O2 + O3): 04 is from 10-5 to 1.0, preferably from 10-4 to 1.0, preferably from 10-3 to 1.0, or even 0, 01 to 1.0, especially from 0.1 to 1.0. [0065] Capsules According to another object, the present invention relates to solid capsules obtainable by the method of the invention. The present invention relates in particular to the solid capsules capable of being obtained by the first variant of the method of the invention defined above, said capsules comprising: a core comprising a solution comprising compound A, an inner envelope comprising a thermoplastic material, -expansible, disposed around said core, and a polymerized rigid external envelope disposed around said inner envelope. According to one embodiment, the solid capsules that can be obtained by the first variant of the process of the invention comprise a heart formed of a single drop, surrounded by a single inner envelope, itself surrounded by a only rigid outer shell polymerized. Figure 3 schematically shows a solid capsule obtained according to this mode (capsule 40). According to another embodiment, the solid capsules obtainable by the first variant of the process of the invention comprise a core formed of several drops, said drops being surrounded by a single and same inner envelope, itself surrounded by a single rigid outer shell polymerized. Figure 3 schematically shows a solid capsule obtained according to this mode (capsule 41). According to another embodiment, the solid capsules that can be obtained by the first variant of the process of the invention comprise a core formed of several drops, each of said drops being surrounded by a separate inner envelope, said inner envelopes being surrounded by a single polymerized rigid outer shell. Figure 3 schematically shows a solid capsule obtained according to this mode (capsule 42). [0066] The present invention also relates to the solid capsules obtainable by the second variant of the process of the invention defined above, said capsules comprising: a core comprising a solution comprising compound A, a polymerized rigid internal envelope disposed around said core, an intermediate envelope comprising a heat-expandable material, disposed around said polymerized rigid inner envelope, and a polymerized rigid external envelope disposed around said intermediate envelope. [0067] According to one embodiment, the solid capsules that can be obtained by the second variant of the process of the invention comprise a heart formed of a single drop, surrounded by a single polymerized rigid inner envelope, itself surrounded by a single intermediate envelope, itself surrounded by a single rigid outer shell polymerized. Figure 4 schematically shows a solid capsule obtained according to this mode (capsule 50). According to another embodiment, the solid capsules that can be obtained by the second variant of the process of the invention comprise a core formed of several drops, said drops being surrounded by a single and same polymerized rigid internal envelope, itself surrounded by a single intermediate envelope, itself surrounded by a single polymerized rigid external envelope. Figure 4 schematically shows a solid capsule obtained according to this mode (capsule 51). According to another embodiment, the solid capsules obtainable by the second variant of the process of the invention comprise a core formed of several drops, each of said drops being surrounded by a separate rigid polymerized internal envelope, said inner envelopes being surrounded by a single intermediate envelope, itself surrounded by a single rigid outer shell polymerized. Figure 4 schematically shows a solid capsule obtained according to this mode (capsule 52). [0068] The present invention also relates to the solid capsules obtainable by the third variant of the method of the invention defined above, said capsules comprising: a core comprising a solution comprising compound A, and a stack of envelopes comprising a heat-expandable material and polymerized rigid envelopes, said envelopes being arranged alternately around said core. Figure 5 schematically shows examples of capsules that can be obtained according to this variant of the process (capsules 60, 61 and 62). [0069] According to another object, the present invention relates to a composition comprising solid capsules that can be obtained by the process of the invention. The present invention thus relates to a composition comprising at least one solid capsule obtained according to one of the variants of the process of the invention, said capsule being dispersed in a continuous liquid phase, preferably corresponding to the composition C4 defined above. Alternatively, the capsules are suspended in a continuous liquid phase which differs from the C4 composition used in process step c). [0070] According to a preferred embodiment, the continuous liquid phase comprises at least one compound B, different from the compound A, capable of reacting with the compound A. According to this embodiment, the method of the invention has the advantage of enabling the two compounds A and B to be present in the same formulation without reacting, until triggering is applied to initiate the release of encapsulated compound A and thus the reaction between said two compounds A and B. Thus, the The method of the invention also makes it possible to ensure that compounds A and B are finally brought into contact according to the optimum concentration, while minimizing the dosing errors of the user. [0071] The pairs of compounds A / B used in the process of the invention are, for example, the pairs of epoxy resin / hardener, monomer / polymerization catalyst, or monomer M1 / monomer M2, M1 and M2 being capable of polymerizing together. [0072] Compounds A which may be used in the context of the present invention are, for example, isocyanate compounds, [3-hydroxylalkylamides, trimellitic glycidyl esters, and melamines and their etherified derivatives. Compounds B which may be used in the context of the present invention are, for example, polyamides, polyamines, hydroxy-functional polyesters, polyethers and polyurethanes. According to one embodiment, compound A is a catalyst capable of crosslinking compound B. [0073] By way of example of a catalyst which can be used as compound A, mention may be made of: peroxides and hydroperoxides, capable of crosslinking unsaturated polyesters, amine hardeners, such as polyamines and polyaminoamines, anhydrides, for example phthalic anhydride, and thiols, capable of crosslinking epoxy resins, metal catalysts, such as dibutyltin dilaurate, capable of crosslinking polyester and / or polyisocyanates, substituted hydroxymethylphenols and substituted aminomethylphenols, capable of crosslinking epoxides; and / or polyurethanes, and organometallic catalysts, such as organotins, bismuth carboxylates, organotitans, zinc acetylacetonates, and aluminum acetylacetonates, capable of crosslinking silicone gums. [0074] The process of the present invention is applicable to all reactions in which it is necessary that at least two compounds be stored separately and mixed at the time of use, such as catalyst and elastomer kits and hair dye kits. The process of the invention is particularly applicable in the field of the production of chemicals, dyes, cosmetics, perfumes, automotive, and paints. Release method According to another object, the present invention relates to a method of releasing a compound A encapsulated in capsules according to the invention. [0075] The present invention relates to a method for releasing a compound A, comprising a step of heating at a temperature T greater than T4 of a composition according to the invention. This heating step at a temperature T greater than T4 is able to expand the thermo-expandable material of the composition C2. Typically, the release temperature T is at least 20 ° C higher than the temperature T4. Preferably, the release temperature T is greater than or equal to T2. [0076] The present invention thus has the advantage of only requiring a temperature rise to allow the release of compound A according to the release method of the invention. Indeed, a simple rise in temperature causes the expansion of the heat-expandable material present in the shell (s) of composition C2 of the capsules, which imposes a mechanical stress on the polymerized rigid shell (s). This mechanical stress results in a permeabilization (increase in permeability) and / or fragmentation (mechanical failure) of this (or these) envelope (s) rigid (which (s) can not (not) dilate) , allowing the release of the compound A contained in the heart of the capsules. In cases where the composition C2 is solid at the temperature T4 (typically at room temperature), T is preferably greater than or equal to the melting point of the heat-expandable material, so that the latter undergoes a change of state. solid liquid, causing expansion capable of fragmenting the polymerized rigid envelope. This is typically the case when the heat-expandable material is a solid wax at temperature T4. Nevertheless, it is possible to carry out the release process at a temperature T less than the melting point of the heat-expandable material. In the case where the composition C2 is liquid at the temperature T4 (typically at room temperature), T is preferably greater than or equal to the boiling point of the heat-expandable material, so that it exhibits a change of state liquid gas causing expansion capable of fragmenting the rigid polymerized shell. This is typically the case when the heat-expandable material is a liquid fluorocarbon at temperature T4. Nevertheless, it is possible to implement the release process at a temperature T less than the boiling point of the heat-expandable material. The present invention thus makes it possible to thermally initiate the reaction between an encapsulated compound A and a compound B contained in the continuous phase of a composition as described above, with the advantage of ensuring the control of the temperature required to initiate the reaction. The triggering of the release may be an overall increase in the temperature of the composition, or a localized temperature increase in the envelope (s) of composition C2 comprising the heat-expandable material. Typically, the temperature T is greater than or equal to 60 ° C, preferably greater than or equal to 70 ° C, advantageously greater than or equal to 80 ° C, for example greater than or equal to 90 ° C. Typically, the temperature T is from 50 ° C to 200 ° C, preferably from 60 ° C to 150 ° C, preferably from 70 ° C to 120 ° C. The heating step can last from 5 minutes to several hours, for example 1 hour or 2 hours. FIG. 1 schematically represents an embodiment of the first variant of the method of the invention. During the first step (step a), a composition C is added with stirring in a composition C2 to obtain drops 1 dispersed in composition C2. In the second step (step b), the emulsion obtained above in a composition C3 is added under stirring to obtain drops 10 dispersed in the composition C3. In the third step (step c), the previously obtained emulsion in a composition C4 is added with stirring to obtain drops dispersed in the composition C4. In the fourth step (step d), the composition C3 is polymerized, whereby solid capsules 30 according to the invention are obtained. [0077] Figure 2 schematically shows an embodiment of the second variant of the method of the invention. During the first step (step a), a composition Cl (drop dispersion comprising compound A in a composition C'3) in a composition C2 is added under stirring, to obtain drops dispersed in composition C2. In the second step (step b), the previously obtained emulsion in a composition C3 is added with stirring to obtain droplets dispersed in the composition C3. In the third step (step c), the previously obtained emulsion in a composition C4 is added with stirring to obtain drops 35 dispersed in the composition C4. In the fourth step (step d), the composition C3 is polymerized, whereby solid capsules 35 according to the invention are obtained. [0078] Figures 3, 4 and 5 show schematically solid capsules 40-41-42, 50-51-52, and 60-61-62 obtained according to the first, second and third variants of the process of the invention, respectively. In these figures, the dashed areas represent the composition C1 containing the compound A, the hatched areas represent the envelopes of composition C2 comprising the heat-expandable material and the black areas represent the rigid polymerized envelopes. Figure 6 schematically shows the fragmentation of a solid capsule 40 according to the invention into a fragmented capsule 70, caused by heating said capsule 40 to trigger the release of compound A contained in its core. The increase in temperature causes the expansion of the internal envelope of composition C2, which causes the fragmentation of the rigid outer shell polymerized, allowing compound A to escape. [0079] EXAMPLES Example 1 - Preparation of capsules according to the invention 1. Capsules according to the first variant of the process This example implemented the first variant of the process according to the invention and aimed to formulate in one and the same formulation the 2-component kit "SYLGARD® 184 Silicone Elastomer" sold by the company Dow Corning. This kit is composed of two components and comprises, on the one hand, a siloxane composition and, on the other hand, a composition comprising a catalyst which is normally to be mixed with the siloxane composition for crosslinking. Thus, if these two components are mixed, a solid polymer matrix is formed in less than 24 hours at room temperature. In this example, the composition C1 corresponded to the first component of the kit 15 above (siloxane composition) and the composition C4 corresponded to the second component of the kit above (catalyst composition): Composition Cl (component No. 1 of the kit SYLGARDD 184 Silicone Elastomer): 55.0% - 75.0% dimethyl, methylhydrogen siloxane, 15.0% - 35.0% dimethyl siloxane, dimethylvinyl-terminated, 10.0% - 30.0% dimethylvinylated and trimethylated silica, 1.0% - 5.0% tetramethyl tetravinyl cyclotetrasiloxane, and less than 0.10% ethylbenzene. Composition C4 (component No. 2 of SYLGARDD 184 Silicone Elastomer Kit): platinum complex (<200 ppm), - 55.0 - 75.0% dimethyl siloxane, dimethylvinyl-terminated, - 30.0 - 50.0 % dimethylvinylated and trimethylated silica, - <1.0% tetra (trimethylsiloxy) silane, - 0.5% xylene, and 30 - 0.2% ethylbenzene. Compositions C2 and C3 have the following compositions: Composition C2: - 50% Syntone PAO 100, and 35 - 50% Assume DM Tablets. [0080] C3 composition: - 10% 1,6-hexanediol diacrylate, - 89% aliphatic polyurethane diacrylate, and - 1 ° / 0 Darocure 1173. [0081] For this example, an ULTRA-TURRAX T-stirrer from IKA was used to form the emulsions. Step a): 1 g of composition C1 was added dropwise to 4 g of composition C2, with stirring, at the temperature T2 = 40 ° C., whereby an emulsion of 10 droplets of composition C1 in the C2 composition was obtained. Step b): This emulsion was then added dropwise to 2 g of composition C3, with stirring, at the temperature T3 = 40 ° C., whereby a Cl - in - C2 - in - C3 emulsion was obtained. been obtained. Step c): This emulsion was then added dropwise to 10 g of C4 composition, with stirring, at the temperature T4 = 25 ° C, whereby a Cl - in - C2 - in - C3 emulsion -in-C4 was obtained. Stage d): This emulsion was then subjected to the radiation of a 400 watt (315 - 395 nm) 400-watt light-beam lamp (315-395 nm), with a luminous intensity of 0.1 W / cm 2, for 3 minutes, which caused the polymerization of the external envelope of composition C3 of the drops of the emulsion. The solid capsules were observed using an Olympus IX71 microscope, equipped with a UPlanSApo 100x / 1.4 objective, and using a JEOL JEM 2010F transmission electron microscope. The average size of the solid capsules was measured using the Image J software and is 2.5 μm ± 1.5. 2. Capsules according to the second variant of the process This example has implemented the second variant of the process according to the invention. invention and aimed to formulate in a single formulation the 2-component kit "SYLGARD® 30 184 Silicone Elastomer" sold by the company Dow Corning. The compositions C2, C3 and C4 used were the same as in Example 1.1 above. However, the composition C1 was previously dispersed in the composition C3: 1 g of composition C1 was added dropwise to 1 g of composition C3, with stirring, whereby an emulsion of droplets of composition Cl in the composition C3 was obtained. [0082] For this example, an ULTRA-TURRAX T 25 agitator from IKA was used to form the emulsions. Step a): The emulsion thus obtained was added dropwise to 4 g of composition C2, with stirring, at a temperature of T2 = 40 ° C., whereby a Cl-5 emulsion in-C3-in -C2 was obtained. Step b): This emulsion was then added dropwise to 1 g of composition C3, with stirring, at the temperature T3 = 40 ° C., whereby a Cl - in - O 3 - in - O 2 emulsion. in-03 was obtained. Step c): This emulsion was then added dropwise to 10 g of C4 composition, with stirring, at the temperature T4 = 25 ° C, whereby a Cl - in - 03 - in - 02 emulsion -in-03-in-04 was obtained. Stage d): This emulsion was then subjected to the radiation of a 400 watt (315 - 395 nm) 400-watt light-beam lamp (315-395 nm), with a luminous intensity of 0.1 W / cm.sup.2, for 3 minutes, which caused the polymerization of the envelopes of composition C3 of the drops of the emulsion. 3. Capsules according to the third variant of the process This example has implemented the third variant of the process according to the invention and aimed to formulate in a single formulation the 2-component kit "SYLGARD® 20 184 Silicone Elastomer" marketed by the company Dow Corning. The compositions 01, C2, C3 and C4 used were the same as in example 1.1 above. For this example, an ULTRA-TURRAX T-stirrer from IKA was used to form the emulsions. [0083] Step a): 1 g of composition C1 was added dropwise to 1 g of composition C2, with stirring, at a temperature of T2 = 40 ° C, whereby a Cl - in C2 emulsion was obtained. droplets of composition C1 in composition C2 was obtained. Step b): This emulsion was then added dropwise to 1 g of composition C3, with stirring, at the temperature T3 = 40 ° C., whereby a Cl - 30 - in - C2 - in - emulsion was obtained. C3 was obtained. Step a) repeated: This emulsion then drops to 1 g of composition C2, with stirring, at the temperature T2 = 40 ° C., whereby a Cl - in - O 2 - emulsion in - 03 - in -02 was obtained. Step b) repeated: This emulsion was then added dropwise to 1 g of composition C3, with stirring, at the temperature T3 = 40 ° C, whereby a C1-in-C2-emulsion in C3-in-C2-in-C3 was obtained. [0084] Step c): This emulsion was then added dropwise to 10 g of composition C4, with stirring, at the temperature T4 = 25 ° C, whereby a Cl - in - C2 - in - emulsion was obtained. C3-in-C2-in-C3-in-C4 was obtained. Stage d): This emulsion was then subjected to the radiation of a 400 watt (315 - 395 nm) 400-watt light-box lamp with a luminous intensity of 0.1 W / cm 2, for 3 minutes, which caused the polymerization of the C3 composition envelopes of the drops of the emulsion. EXAMPLE 2 Stability of the Capsules According to the Invention The viscosity of the compositions obtained at the end of step d) of Examples 1.1, 1.2 and 1.3 were measured over time to verify that the composition C encapsulated in the core capsules remained well confined and in particular that it did not meet the composition C4. Viscosity was measured at 25 ° C with a HAAKETM Rheostress 600 Rheometer over 30 days and no variation was observed, showing that no leakage of Cl composition occurred. On the 30th day, the compositions were brought to 90 ° C. for 2 hours in order to liberate the composition C. At the end of this heating, the viscosity could not be measured because the compositions had polymerized. [0085] EXAMPLE 3 Fragmentation of the Capsules According to the Invention The composition obtained in Example 1.1 was observed by microscopy (Olympus IX71 microscope equipped with a UPlanSApo 100x / 1.4 objective). [0086] Before heating the composition (2 h at 90 ° C.), the capsules were intact. After heating (2 h at 90 ° C.), the capsules were fragmented. Comparative Example 4 Comparative capsules obtained according to a process not according to the invention were also prepared. According to a first comparative test, capsules were prepared following the method of Example 1 with the exception of steps c) and d). These capsules therefore did not have a rigid outer shell polymerized. Left at room temperature, the composition obtained polymerized on the 2nd day. [0087] In a second comparative trial, capsules were prepared following the procedure of Example 1 except step b). These capsules therefore did not have a heat-expandable envelope. Left at room temperature, the composition obtained polymerized as of the 5th day.
权利要求:
Claims (16) [0001] REVENDICATIONS1. Process for the preparation of solid capsules (30; 35), comprising the following steps: a) stirring addition of a composition C1 comprising at least one compound A, in a liquid composition C2 comprising a heat-expandable material, C1 and C2 n being not miscible with each other, C2 being at a temperature T2, whereby an emulsion comprising drops (1; 5) of composition C1 dispersed in composition C2, b) stirring addition of emulsion obtained in step a) in a liquid composition C3 capable of being polymerized, C3 and C2 not being miscible with each other, C3 being at a temperature T3, preferably equal to T2, in which an emulsion comprising drops (10; 15) dispersed in the composition C3 is obtained; c) addition, with stirring, of the emulsion obtained in step b) in a liquid composition C4, C4 and C3 being immiscible; one in the other, C4 being at a lower temperature T4 or equal to T2 and less than or equal to T3, whereby an emulsion comprising drops (20; 25) dispersed in the composition C4, and d) polymerization of the drops (20; 25) obtained in step c), whereby solid capsules (30; 35) dispersed in the composition C4 are obtained. [0002] 2. The method of claim 1, wherein the composition C1 is a solution comprising the compound A in solubilized form. [0003] 3. Method according to claim 1, wherein the composition C1 is an emulsion formed of drops of a solution comprising the compound A in solubilized form, said drops being dispersed in a C3 composition capable of being polymerized. 3031914 38 [0004] 4. Method according to one of claims 1 to 3, wherein is repeated, after step b) and before step c), at least once steps a) and b). [0005] 5. The method according to one of claims 1 to 4, wherein the heat-expandable material is selected from the group consisting of waxes, fluorocarbons, and mixtures thereof. [0006] 6. Method according to one of claims 1 to 5, wherein the thermoexpansible material is a hydrocarbon wax, plant, mineral, animal and / or synthetic. [0007] 7. The process according to one of claims 1 to 6, wherein the heat-expandable material comprises a wax selected from the group consisting of mono-, di- and triesters of glycerol and fatty acids having a linear or branched hydrocarbon chain comprising from 8 to 24 carbon atoms, and mixtures thereof, preferably from the group consisting of glycerol trimyristate, glycerol tripalmitate, glycerol monostearate, glycerol cetylpalmitate and mixtures thereof. 20 [0008] The process according to one of claims 1 to 5, wherein the heat-expandable material is a fluorocarbon selected from the group consisting of C6-C20 fluorinated aromatic compounds, C6-C20 linear or cyclic fluorinated hydrocarbons, hydrocarbons and the like. C 6 -C 20 unsaturated fluorinated fluorinated esters, C 3 -C 20 fluorinated esters, C 3 -C 20 fluorinated ethers, C 3 -C 20 fluorinated ketones, and C 3 -C 20 fluorinated carbonates. [0009] 9. Method according to one of claims 1 to 8, wherein the composition C3 comprises at least one unsaturated monomer or unsaturated prepolymer, preferably carrying (meth) acrylate functional groups, a crosslinking agent and a photoinitiator. [0010] 10. Method according to one of claims 1 to 9, wherein the composition C4 comprises at least one compound B, different from the compound A, capable of reacting with the compound A. [0011] 11. Method according to one of claims 1 to 10, wherein step d) is carried out by exposure of the drops (20; 25) obtained at the end of step c) to 3031914 39 light radiation suitable for polymerize the composition C3 and the composition C'3 optionally present. [0012] 12. A solid capsule (30) obtainable by the method according to any one of claims 1, 2 and 4 to 11 comprising: a core comprising a solution comprising compound A, an inner shell comprising a thermo material -expansible disposed around said core, and a polymeric rigid outer envelope disposed around said inner casing 10. [0013] 13. The solid capsule (35) obtainable according to the process according to claim 1, comprising: a core comprising a solution comprising compound A, a polymerized rigid internal envelope disposed around said core; , an intermediate envelope comprising a heat-expandable material disposed around said polymerized rigid inner envelope, and a polymerized rigid external envelope disposed around said intermediate envelope. 20 [0014] 14. Composition comprising at least one solid capsule (30) according to claim 12 or at least one solid capsule (35) according to claim 13, said capsule being dispersed in a continuous liquid phase corresponding preferably to the composition C4 defined in the claim 1. 25 [0015] 15. The composition of claim 14, wherein the continuous liquid phase comprises at least one compound B, different from the compound A, capable of reacting with the compound A. [0016] 16. A method of releasing a compound A, comprising a step of heating to a temperature T greater than T4 of a composition according to claim 14 or 15.
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同族专利:
公开号 | 公开日 US20200324263A1|2020-10-15| US20180008948A1|2018-01-11| KR20180005651A|2018-01-16| EP3250316A1|2017-12-06| WO2016120308A1|2016-08-04| FR3031914B1|2019-06-07| US10786798B2|2020-09-29| IL253723D0|2017-10-31| CN108112238B|2021-06-04| CN108112238A|2018-06-01|
引用文献:
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法律状态:
2015-12-15| PLFP| Fee payment|Year of fee payment: 2 | 2016-07-29| PLSC| Publication of the preliminary search report|Effective date: 20160729 | 2016-12-16| TP| Transmission of property|Owner name: CALYXIA, FR Effective date: 20161109 | 2017-01-20| PLFP| Fee payment|Year of fee payment: 3 | 2018-04-20| PLFP| Fee payment|Year of fee payment: 4 | 2019-12-12| PLFP| Fee payment|Year of fee payment: 6 | 2020-12-30| PLFP| Fee payment|Year of fee payment: 7 | 2021-12-10| PLFP| Fee payment|Year of fee payment: 8 |
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申请号 | 申请日 | 专利标题 FR1550617|2015-01-27| FR1550617A|FR3031914B1|2015-01-27|2015-01-27|ENCAPSULATION METHOD|FR1550617A| FR3031914B1|2015-01-27|2015-01-27|ENCAPSULATION METHOD| EP16701769.8A| EP3250316A1|2015-01-27|2016-01-27|Encapsulation method| PCT/EP2016/051660| WO2016120308A1|2015-01-27|2016-01-27|Encapsulation method| US15/546,033| US10786798B2|2015-01-27|2016-01-27|Encapsulation method| CN201680012630.8A| CN108112238B|2015-01-27|2016-01-27|Encapsulation method| KR1020177023907A| KR20180005651A|2015-01-27|2016-01-27|Encapsulation method| IL253723A| IL253723D0|2015-01-27|2017-07-30|Encapsulation method| US16/911,778| US20200324263A1|2015-01-27|2020-06-25|Encapsulation method| 相关专利
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